Coin-Stack Jar Unpacking
The most economic & high throughput (50~150WPH) unpacking & packing sorter transfers thin and thick wafers between FOUP, FOSB, cassette, jar, and pod; a bridge tool for 6", 8" & 12" wafers; equipped with vortex type contamination-free non-contact edge gripper with fail-safe mechanism; optical sensor to distinguish paper or plastic divider... Read more »
MEMS Wafer Handling
Regardless of wafer thickness, from 50 µm thin wafers to 6mm bonded wafers, or perforated, warped, bumped, and over-sized carrier wafers, our MEMS wafer transfer automation solution provides the precision and repeatability tolerance required by the MEMS industry. High through-put 4-axis SCARA robots with machine vision are used for alignment & placement for your micro manufacturing... Read more »
Auto Visual Inspector
LED sapphire wafer handling for surface defect inspection gets easier - facilitated by a robot for automated pick, flip, align, and ID reading; no human intervention needed, except the visual checking, to meet customers' growing requirement of hands-off operation (Click above picture for demo clip). Also check out our semi-auto wafer feeder to dock to your current process or metrology tool... Read more »
Latest News
A leading provider of CMP/Grinding tool OEM has placed a repeated order for wafer handllers to meet this 50-micron thin wafer need in wafer thinning application for global semiconductor, Data Storage, MEMS, LED, Photonics and Precision Optics industries.
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Applications
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he industries we serve include semiconductor fabrication, 3D-IC WLP, HB-LED, bio-tech, hard-drive, printing etc. Our installed base includes most of the prominent IC fabs and OSAT's around the globe. From standard to custom...
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Vertical Integration
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rom tool-to-tool and tool-to-host communication and material tracking systems, to equipment design and home-grown robotics & handlers, to in-house precision machine shop for high tolerance fixture, we are your one-stop service provider...
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Robotics & Peripherals
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he CE-compliant, ISO-class 1 cleanliness robot family is modular in design with configuration of 3-axis, 4-axis, or 5th-axis flipper, also with external vertical or horizontal tracks, compatible with vacuum or pneumatic capabilities...
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